Photoelastic analysis of thermal stresses

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dc.contributor.authorBurger, Christian Peteren_ZA
dc.date.accessioned2015-07-14T08:48:39Z
dc.date.available2015-07-14T08:48:39Z
dc.date.issued1967en_ZA
dc.description.abstractDevelopments in the application of photoelastic techniques to the study of thermal stress problems are here briefly reviewed, then followed by a short introduction to the relevant photoelastic and thermoelastic theories. A new method for the study of transient thermal stresses; as well as stresses due to the internal heating of nuclear reactor parts, is described. In this method hot or cold liquid is circulated continuously over the surfaces of a composite photoelastic model which incorporates the sandwich type of built in polariscope developed by Tramposch and Gerard. By varying the temperatures· of the liquid and the flow rates to one or all the surfaces of a model, the temperature profile in the model can be controlled at will. The instantaneous temperature profile is sensed by banks of thermocouples which are scanned in sequence with a specially built rotary switch, and their outputs are recorded on a storage oscilloscope. The thermocouples here, are for the first time, mounted outside the sandwiched polariscope in a separate sensor block where they do not disturb the photoelastic fringe pattern of the thermally induced stresses. The stress fringe patterns are observed continuously and photographed according to a set time schedule in synchronism with the temperature pattern on the oscilloscope screen. Thus a simultaneous record of the thermal stresses as they develop in the model 1 and the temperature profiles that cause them, is obtained. The test method is applied to the study of thermal stresses in an unconstrained thick plate with a temperature gradient across its thickness. Two models are used, one of uniform thickness and another which has a small change in thickness at a Single radiused shoulder. The ratio of thick to thin section is 1.1 to 1. Three basic types of temperature gradient are induced in each model, i.e. firstly: equal heating on both faces of a plate initially at uniform temperature; secondly: heating on one side only, of a plate initially at uniform temperature; and thirdly: heating on the cold side only, of a plate with an initial linear temperature gradient between a cold side and a hot side.en_ZA
dc.identifier.apacitationBurger, C. P. (1967). <i>Photoelastic analysis of thermal stresses</i>. (Thesis). University of Cape Town ,Faculty of Engineering & the Built Environment ,Department of Mechanical Engineering. Retrieved from http://hdl.handle.net/11427/13431en_ZA
dc.identifier.chicagocitationBurger, Christian Peter. <i>"Photoelastic analysis of thermal stresses."</i> Thesis., University of Cape Town ,Faculty of Engineering & the Built Environment ,Department of Mechanical Engineering, 1967. http://hdl.handle.net/11427/13431en_ZA
dc.identifier.citationBurger, C. 1967. Photoelastic analysis of thermal stresses. University of Cape Town.en_ZA
dc.identifier.ris TY - Thesis / Dissertation AU - Burger, Christian Peter AB - Developments in the application of photoelastic techniques to the study of thermal stress problems are here briefly reviewed, then followed by a short introduction to the relevant photoelastic and thermoelastic theories. A new method for the study of transient thermal stresses; as well as stresses due to the internal heating of nuclear reactor parts, is described. In this method hot or cold liquid is circulated continuously over the surfaces of a composite photoelastic model which incorporates the sandwich type of built in polariscope developed by Tramposch and Gerard. By varying the temperatures· of the liquid and the flow rates to one or all the surfaces of a model, the temperature profile in the model can be controlled at will. The instantaneous temperature profile is sensed by banks of thermocouples which are scanned in sequence with a specially built rotary switch, and their outputs are recorded on a storage oscilloscope. The thermocouples here, are for the first time, mounted outside the sandwiched polariscope in a separate sensor block where they do not disturb the photoelastic fringe pattern of the thermally induced stresses. The stress fringe patterns are observed continuously and photographed according to a set time schedule in synchronism with the temperature pattern on the oscilloscope screen. Thus a simultaneous record of the thermal stresses as they develop in the model 1 and the temperature profiles that cause them, is obtained. The test method is applied to the study of thermal stresses in an unconstrained thick plate with a temperature gradient across its thickness. Two models are used, one of uniform thickness and another which has a small change in thickness at a Single radiused shoulder. The ratio of thick to thin section is 1.1 to 1. Three basic types of temperature gradient are induced in each model, i.e. firstly: equal heating on both faces of a plate initially at uniform temperature; secondly: heating on one side only, of a plate initially at uniform temperature; and thirdly: heating on the cold side only, of a plate with an initial linear temperature gradient between a cold side and a hot side. DA - 1967 DB - OpenUCT DP - University of Cape Town LK - https://open.uct.ac.za PB - University of Cape Town PY - 1967 T1 - Photoelastic analysis of thermal stresses TI - Photoelastic analysis of thermal stresses UR - http://hdl.handle.net/11427/13431 ER - en_ZA
dc.identifier.urihttp://hdl.handle.net/11427/13431
dc.identifier.vancouvercitationBurger CP. Photoelastic analysis of thermal stresses. [Thesis]. University of Cape Town ,Faculty of Engineering & the Built Environment ,Department of Mechanical Engineering, 1967 [cited yyyy month dd]. Available from: http://hdl.handle.net/11427/13431en_ZA
dc.language.isoengen_ZA
dc.publisher.departmentDepartment of Mechanical Engineeringen_ZA
dc.publisher.facultyFaculty of Engineering and the Built Environment
dc.publisher.institutionUniversity of Cape Town
dc.subject.otherMechanical Engineeringen_ZA
dc.titlePhotoelastic analysis of thermal stressesen_ZA
dc.typeDoctoral Thesis
dc.type.qualificationlevelDoctoral
dc.type.qualificationnamePhDen_ZA
uct.type.filetypeText
uct.type.filetypeImage
uct.type.publicationResearchen_ZA
uct.type.resourceThesisen_ZA
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